【Product Description】GR系列导热凝胶是一种双组份适用于室温及加热固化，具有高导热性能并且非常柔软的流体型有机硅导热材料。在固化前，该产品保持良好的触变流动性，可以通过点胶/涂膜/印刷等施工方式，轻易的渗入间隙或孔洞，是脆弱电子元器件或不平整组件连接散热器的可自动化生产的解决方案。 不同于导热硅脂，GR系列导热凝胶固化后仍然是一个低模量弹性体，具有优良的耐老化和耐高低温性能，长时间使用不会粉化，具有低渗油、低挥发、低热阻、低应力特性，易清理/返工；相比于导热垫片，具有更低的使用厚度，对界面润湿性更
【Features and advantages】•低硬度、低渗油、低挥发、低热阻、低应力
•易于点胶
•适用于室温及加热固化
•良好的电气绝缘性、耐温耐候性
1.5W/mk 、2W/mk
Shore00 30-55
≤400 ,000Ccps（@25℃）
0.05-0.08mm
2.5g/cm3 1.95g/cm3
20min(@100℃) 6h(@25 ℃）
≥6（KV@1mm）
≤0.11（℃·in2/w）、0.13（℃·in2/w）
UL94 V-0
-40℃~200℃
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