ST系列导热垫片是硅胶和氧化铝陶瓷粉末的复合材料,是一款柔软的导热填隙材料。可用于热源与散热器件之间,优化整体的热传递效率。 ST系列导热垫片具有电气绝缘、阻燃、可压缩性能好,适用于常规导热需求应用。
•可选单面粘性或双面粘性
•可定制颜色和尺寸
•低硬度,高回弹
1.5W-3.5W/mk
Shore00 35-60
6.0KV/mm)
1.0-10mm
2.1-2.9g/cm3 1.95g/cm3
20min(@100℃) 6h(@25 ℃)
UL94 V-0
-40℃~200℃
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The rapid development of modern industry promotes the pace of social progress, provides more convenient conditions for our work and life, and improves everyone's sense of gain and happiness. DEM has been deeply engaged in the modern industrial market
Application Scheme of New Energy Vehicle Market
In the field of new energy vehicles, DEM is committed to developing environment-friendly, safe and reliable high-performance material solutions. In the reinforcement, sealing, heat insulation, heat dissipation and other scenarios of PACK compone
Application Scheme of Intelligent Electronic Marke
With the development of the times and the progress of science and technology, intelligent electronic devices have penetrated into all aspects of personal life and are closely related to modern life, such as smart phones, smart wear, smart homes, etc. From
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